Copper oxide powder - copper contend 79.8%
1. supplementary source of copper in electroplating process of PCB or Semiconductor The HDI process for major clients
2.Ceramic color mixing
3. Wood Preservation
4. Firecrackers raw materials
Specification Unit : ppm
Spec. CuO Ni Fe Sn Pb Zn Cl Acid insoluble Moisture Content Dissolving speed
≧99% ≦10 ≦30 ≦10 ≦5 ≦30 ≦15 ≦30 ≦0.5% ≦30 sec.
Analysis Result 99.95% 1.28 4.82 N.D N.D 5.22 N.D 10 0.30% 18 sec.

Carbonate of copper powder - copper contend 57.6%
1. supplementary source of copper in electroplating process of PCB or Semiconductor The HDI process for major clients
2.Catalyzer
3.Wood Preservation
Specification
Spec. CuCO3 Ni Fe Sn Pb Zn Cl
99.95% ≦10 ≦30 ≦10 ≦5 ≦30 ≦15

Copper sulfate powder - copper contend 25.4%
1. PCB/semiconductor to electroplate at initial make-up of electrolytic bath
2.Pesticide mixture
3.Industrial mixture
4.Medical mixture
Specification
Spec. CuSO4 Ni Fe Sn Pb Zn Cl
99.95% ≦10 ≦10 ≦10 ≦5 ≦10 ≦10

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